There are various specimen preparation techniques used for SEM EBSD analysis. Some of the traditional methods such as cutting and polishing are generally used to remove surface roughness and to obtain a flat surface. Such traditional mechanical techniques apply shear forces to the sample, which result in surface artifacts like scratches, smearing, delamination and other damages. All these issues are overcome by Broad Ion Beam Polishing System BIPS 1503, in which a beam of high energy Argon ions is bombarded to remove the material from sample surface. This system is used for both the surface polishing and cross section milling.
As the broad Argon ion beam is used to etch the material, no mechanical stress is applied, causing extremely flat surface and cross section without any artifacts revealing its internal microstructure and features. Ion milling rate and depth can be controlled by varying applied power and beam incident angle
Ion Milling Process Chamber:
Ion milling chamber manufactured from single block machined Aluminum is pumped using turbomolecular pump backed by dry scroll pump to enable base pressure of 2 X 10⁻⁶ mbar or better
Argon Ion Source (Mascotek’s Model: IS203) for EBSD Ion Milling
Specimen Holder for EBSD Milling:
Argon Ion Source (Mascotek’s Model: IS203CS) for Cross-Sectional Milling:
Specimen Holder for Cross Section Milling:
Either of the sources (EBSD or Cross section milling) along with their respective specimen holders will be used at a single time
User Interface:
Process control done using PLC with 7-inch touch screen HMI
HD CMOS Camera:
HD CMOS camera for real time imaging of ion beam milling process with sharp image and video capturing function
Option:
Liquid Nitrogen Dewar with thermally conductive wire contacts provided to cool specimen holder up to -40°C
230V, 50Hz
L 890mm x W 720mm x H 1240mm

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